Assembly Technology & Capabilities for Electronic Manufacturing
At Adonai Technologies, we leverage advanced Assembly Technology to provide precise, scalable solutions tailored to diverse electronics manufacturing needs. Our capabilities in Surface Mount Technology (SMT), Through-Hole Assembly, and Mixed Assembly allow us to expertly handle a wide range of component types, board configurations, and production volumes, ensuring each project receives the best approach for its unique specifications.
With state-of-the-art equipment and a skilled team, we are equipped to maintain high standards for quality, consistency, and efficiency at every step. From quick-turn prototypes to complex, full-scale production runs, we prioritize reliability and performance, so each assembly is built to exceed expectations in its field of application.
Assembly Technology Capabilities
Surface Mount Technology (SMT)
Our Surface Mount Technology (SMT) capabilities allow us to deliver high-speed, high-precision assembly suitable for complex designs and miniaturized components. We handle single and double-sided boards with a range of component sizes, ensuring optimal placement and alignment for efficient, reliable circuits.
Key Benefits:
- Chip sizes as small as 008004 (0201 metric) for dense designs.
- Larger components up to 120mm x 90mm with mounting heights up to 35mm.
- Handles boards as large as 1240mm x 510mm.
- High-volume production capacity for fast, efficient output.
- Automated Optical Inspection (AOI) and X-ray inspections ensure precision and quality.
Through Hole Technology (THT)
For projects requiring robust connections, our Through-Hole Assembly (THT) provides durability and reliability, especially for components subjected to mechanical stress or high-power applications. Utilizing both wave and selective soldering techniques, we ensure consistent quality and longevity for each through-hole component.
Key Capabilities:
- PCB sizes sizes up to 508mm x 508mm.
- Selective soldering for precision and repeatability.
- Wave soldering ideal for high-volume production.
- Durable assemblies suited for industrial, medical, and aerospace applications.
- Supports high-current components for long-lasting performance.
Mixed Assembly Technology (SMT & ThT)
Our Mixed Assembly service combines the strengths of both SMT and Through-Hole Assembly to deliver complex, multi-component boards optimized for performance. This approach is perfect for designs that require high-density configurations, allowing seamless integration of both surface-mount and through-hole components.
Key Capabilities:
- Combines SMT on one or both sides with through-hole components for complex assemblies.
- Supports micro-BGA, QFN, CSP, and other high-density components for intricate layouts.
- Functional testing and X-ray inspection ensure that each mixed assembly performs reliably in its intended application.